其它积累 · 2023年8月9日

高通芯片启动分析【9X07】

Cold boot

APPS PBL → SBL1 → QTEE → SBL1 → RPM_FW → APPSBL

§SBL1 does all setup and initialization in preparation for WDOG reset debug

Watchdog reset (first reset)

APPS PBL → SBL1 segment 2, bring DDR out of self-refresh → QTEE

QTEE flushes the cache, saves on-chip debug buffer, before forcing second reset via PS_HOLD drop

Second reset

APPS PBL → SBL1 → Sahara download mode

SBL1 supports default memory dump feature to dump the DDR via USB

L1!=IMEM ,  ROM = 144k,   A7(  L1=16K,L2=L2 TCM =256K )  M3(  IMEM=RPMcodeRAM = 16k )  DSP(L2=Hexagon TCM=768K)   L1不会给外部使用,CPU自己的指令处理与数据缓存,L2会有部分放开给处部使用,SBL用了A7L2=234KB22KPBL用了,而DSPL2开放了部分给modemMBA

一些简称:

BP:一般是指modem,用于和基站网络通信用的;对上(BP侧)提供通用的AT命令,来实现交互

AP:一般指主控界面,和用户直接打交道,复制界面显示和控制,负责发送AT命令给AP侧,并响应对应的ACK。

EFS :Embedded file system
FW :Firmware
HLOS: High-level operating system
MBA :Modem boot authenticator
MISC :Multi-image signature and integrity check
 PIL :Peripheral image loader
PRL :Preferred roaming list
QHEE :Qualcomm hypervisor execution environment
QTEE: Qualcomm Trusted Execution Environment
RPM :Resource power manager  
SP PBL :Secure processor primary boot loader
XBL :eXtensible boot loader    
QMI :   高通信息接口

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